ES-6103 Rev.11

R5-ND1

Remote I/O R5 Series

DeviceNet INTERFACE MODULE

(for 16-point analog signals)

MODEL: R5-ND1[1]

ORDERING INFORMATION

• Code number: R5-ND1[1]
Specify a code from below for [1].
  (e.g. R5-ND1/Q)
• Specify the specification for option code /Q
  (e.g. /C01)

[1] OPTIONS

blank: none
/Q: With options (specify the specification)

SPECIFICATIONS OF OPTION: Q

COATING (For the detail, refer to our web site.)
/C01: Silicone coating
/C02: Polyurethane coating
/C03: Rubber coating

RELATED PRODUCTS

• PC Configurator cable (model: MCN-CON or COP-US)
• PC configurator software (model: R5CON)
• EDS file
The EDS files and configurator software are downloadable at our web site.

GENERAL SPECIFICATIONS

Connection
  DeviceNet: Euro type connector terminal
  (applicable wire size: 0.2 – 2.5 mm2, stripped length 7 mm)
  Internal bus: Via the Installation Base (model: R5-BS)
  Internal power: Via the Installation Base  (model: R5-BS)
Isolation: DeviceNet to internal bus or internal power
Data allocation: Mode 1 or 2 set with the side DIP switch
Configurator connection: 2.5 dia. miniature jack

DeviceNet COMMUNICATION

Transmission cable: Approved for DeviceNet
Node address setting: DIP switch; 00 – 63
Baud rate setting: DIP switch
125 kbps, 250 kbps, 500 kbps
NS (Network Status) indicator: Bi-color (green/red) LED
indicates status of the communication link.
MS (Module Status) indicator: Bi-color (green/red) LED
indicates device status.

INSTALLATION

Supply voltage to network: 11 – 25 V DC supplied through the network terminal block
Supply current to network: 50 mA max.
Operating temperature: -10 to +55°C (14 to 131°F)
Operating humidity: 30 to 90 %RH (non-condensing)
Atmosphere: No corrosive gas or heavy dust
Mounting: Installation Base (model: R5-BS)
Weight: 100 g (0.22 lb)

PERFORMANCE

Insulation resistance: ≥ 100 MΩ with 500 V DC
Dielectric strength: 2000 V AC @ 1 minute (DeviceNet to internal bus or internal power)

STANDARDS & APPROVALS

EU conformity:
EMC Directive 
  EMI EN 61000-6-4
  EMS EN 61000-6-2
RoHS Directive

EXTERNAL VIEW

TRANSMISSION DATA DESCRIPTIONS

The DIP SW located at the side of the module switches the unit's data allocation mode.
The Data Allocation Mode 1 is used when all analog I/O modules are single-channel types. In this mode, one (1) word is assigned for one I/O module. The second channel on the dual-channel modules cannot be used. Max. 16 I/O modules can be used per station.
The Data Allocation Mode 2 is used when one or more analog I/O modules are dual-channel types. In this mode, two (2) words are assigned for one I/O module regardless of whether the second word area is required or not. For example, discrete I/O modules require only one (1) word, but two (2) words are automatically assigned to these modules.
■ I/O CAPACITY
In Data Allocation Mode 1, a maximum of 16 I/O modules can be mounted per node. If two-channel type analog modules are mixed, the second channel I/O cannot be used.
In Data Allocation Mode 2, a maximum of 8 I/O modules can be mounted per node.

I/O DATA DESCRIPTIONS

The data allocations for typical I/O modules are shown below.
Refer to the manual for each module for detailed data allocations.
■ANALOG 16 BITS DATA
■ 16-POINT DISCRETE DATA
■ 4-POINT DISCRETE DATA

EXTERNAL DIMENSIONS unit: mm [inch]

SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM